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Wire Bond Surface Coining Base Transistor Outline Package

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Wire Bond Surface Coining Base Transistor Outline Package

Wire Bond Surface Coining Base Transistor Outline Package

Product Name Robust Coining Base with A Large Diameter Wire Bond Surface Product Model JOPTEC Plating Coating Fully plating Au or selective plating Au Finish Shell and pins are plated Ni:2~11.43um and ...

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